I-substrate ye-SiC yokugqoka ifilimu ye-CVD

Incazelo emfushane:

I-Chemical Vapor Deposition I-Chemical vapor deposition (CVD) oxide iyinqubo yokukhula eqondile lapho igesi eyandulelayo ifaka ifilimu elincanyana ku-wafer kureactor. Inqubo yokukhula izinga lokushisa eliphansi futhi inezinga eliphezulu lokukhula uma liqhathaniswa ne-thermal oxide. Iphinde ikhiqize izendlalelo ze-silicon dioxide ezacile kakhulu ngoba ifilimu isusiwe esikhundleni, kunokuba ikhule. Le nqubo ikhiqiza ifilimu enokumelana nogesi okuphezulu, okuhle kakhulu ukusetshenziswa kuma-ICs namadivayisi we-MEMS, phakathi kwezinye eziningi ...


  • Imbobo:Weifang noma Qingdao
  • Ubulukhuni be-Mohs entsha: 13
  • Impahla eluhlaza:I-Silicon Carbide
  • Imininingwane Yomkhiqizo

    I-ZPC - umkhiqizi we-silicon carbide ceramic

    Omaka bomkhiqizo

    I-Chemical Vapor Deposition

    I-Chemical vapor deposition (CVD) oxide iyinqubo yokukhula eqondile lapho igesi eyandulelayo ifaka ifilimu elincanyana ku-wafer kureactor. Inqubo yokukhula izinga lokushisa eliphansi futhi inezinga eliphezulu lokukhula uma liqhathaniswai-thermal oxide. Iphinde ikhiqize izendlalelo ze-silicon dioxide ezacile kakhulu ngoba ifilimu isusiwe esikhundleni, kunokuba ikhule. Le nqubo ikhiqiza ifilimu enokumelana nogesi okuphezulu, okuhle kakhulu ukusetshenziswa kuma-ICs namadivayisi we-MEMS, phakathi kwezinye izinhlelo zokusebenza eziningi.

    I-Chemical vapor deposition (CVD) oxide yenziwa uma ungqimba lwangaphandle ludingeka kodwa i-silicon substrate ingase ingakwazi ukufakwa i-oxidized.

    Ukukhula Kwe-Chemical Vapor Deposition:

    Ukukhula kwe-CVD kwenzeka lapho igesi noma umhwamuko (i-precursor) yethulwa endaweni yokushisa ephansi lapho ama-wafers ahlelwa ngokuqondile noma ngokuvundlile. Igesi ihamba ohlelweni futhi isakaza ngokulinganayo ebusweni bamawafa. Njengoba lezi zandulela zihamba nge-reactor, ama-wafers aqala ukuwamunca ebusweni bawo.

    Uma izandulela sezisabalalise ngokulinganayo ohlelweni lonke, ukuhlangana kwamakhemikhali kuqala ngaphezu kwama-substrates. Lokhu kusabela kwamakhemikhali kuqala njengeziqhingi, futhi njengoba inqubo iqhubeka, lezi ziqhingi ziyakhula futhi zihlangane ukuze zenze ifilimu efunwayo. Ukusabela kwamakhemikhali kudala ama-biproducts ngaphezulu kwamawafa, asabalele ngaphesheya kongqimba lomngcele futhi ageleze aphume ku-reactor, kushiye amawafa nje anefilimu yawo efakwe ifilimu.

    Umfanekiso 1

    Inqubo yokubeka umhwamuko wamakhemikhali

     

    (1.) I-Gas/Vapor iqala ukusabela futhi yakhe iziqhingi endaweni engaphansi kwe-substrate. (2.) Iziqhingi ziyakhula futhi ziqala ukuhlangana ndawonye. (3.) Ifilimu eqhubekayo, efanayo idaliwe.
     

    Izinzuzo Ze-Chemical Vapor Deposition:

    • Inqubo yokukhula kwezinga lokushisa eliphansi.
    • Izinga lokubeka ngokushesha (ikakhulukazi i-APCVD).
    • Akufanele kube yi-silicon substrate.
    • Ukufakwa kwezinyathelo ezinhle (ikakhulukazi i-PECVD).
    Umfanekiso 2
    I-CVD vs. Thermal oxideUkufakwa kwe-silicon dioxide ngokumelene nokukhula

     


    Ukuze uthole ulwazi olwengeziwe mayelana nokufakwa komhwamuko wamakhemikhali noma ukucela ikhotheshini, sicelaXHUMANA ne-SVMnamuhla ukukhuluma nelungu lethimba lethu labadayisi.


    Izinhlobo ze-CVD

    I-LPCVD

    I-low pressure chemical vapor deposition iyinqubo evamile yokubeka umhwamuko wamakhemikhali ngaphandle kokucindezela. Umehluko omkhulu phakathi kwe-LPCVD nezinye izindlela ze-CVD izinga lokushisa lokubeka. I-LPCVD isebenzisa izinga lokushisa eliphakeme kakhulu ukufaka amafilimu, ngokuvamile ngaphezu kuka-600°C.

    Indawo enengcindezi ephansi idala ifilimu efanayo kakhulu enokuhlanzeka okuphezulu, ukukhiqiza kabusha, kanye ne-homogeneity. Lokhu kwenziwa phakathi kuka-10 - 1,000 Pa, kuyilapho ukucindezela kwegumbi okujwayelekile kungu-101,325 Pa. Izinga lokushisa linquma ukushuba nokuhlanzeka kwalawa mafilimu, amazinga okushisa aphezulu abangela amafilimu aqinile futhi acwenge kakhulu.

     

    I-PECVD

    I-Plasma ethuthukisiwe ukufakwa komhwamuko wamakhemikhali izinga lokushisa eliphansi, indlela yokubeka ifilimu ephezulu. I-PECVD yenzeka ku-rector ye-CVD ngokungezwa kwe-plasma, okuyigesi eyingxenye ye-ionized enokuqukethwe okuphezulu kwama-electron wamahhala (~50%). Lena indlela yokubeka izinga lokushisa eliphansi eyenzeka phakathi kuka-100°C - 400°C. I-PECVD ingenziwa emazingeni okushisa aphansi ngoba amandla avela kuma-electron amahhala ahlukanisa amagesi asebenzayo ukuze akhe ifilimu endaweni eyi-wafer.

    Le ndlela yokubeka isebenzisa izinhlobo ezimbili ezihlukene ze-plasma:

    1. Kubanda (okungezona ezishisayo): ama-electron anezinga lokushisa eliphakeme kunezinhlayiya ezingathathi hlangothi nama-ion. Le ndlela isebenzisa amandla ama-electron ngokushintsha ingcindezi ekamelweni lokubeka.
    2. I-Thermal: ama-electron ayizinga lokushisa elifanayo nezinhlayiya nama-ion ekamelweni lokubeka.

    Ngaphakathi kwegumbi lokubeka, i-voltage ye-radio-frequency ithunyelwa phakathi kwama-electrode ngaphezulu nangaphansi kwewafa. Lokhu kushaja ama-electron futhi kuwagcina esesimweni esijabulisayo ukuze kufakwe ifilimu oyifunayo.

    Kunezinyathelo ezine zokukhulisa amafilimu nge-PECVD:

    1. Beka isicwecwana esiyithagethi ku-electrode ngaphakathi kwegumbi lokubeka.
    2. Yethula amagesi asebenzayo kanye nezinto zokubeka ekamelweni.
    3. Thumela i-plasma phakathi kwama-electrode futhi usebenzise i-voltage ukuze ujabulise i-plasma.
    4. Igesi esebenzayo iyahlukanisa futhi ihlangane ne-wafer surface yakhe ifilimu elincanyana, imikhiqizo ephumayo isakazeka ngaphandle kwegumbi.

     

    I-APCVD

    Umfutho we-atmospheric chemical vapor deposition yindlela yokubeka izinga lokushisa eliphansi eyenzeka esithandweni ngomfutho womoya ojwayelekile. Njengezinye izindlela ze-CVD, i-APCVD idinga igesi eyandulelayo ngaphakathi kwegumbi lokubeka, bese izinga lokushisa likhuphuka kancane ukuze libangele ukusabela endaweni eyilucwecwana bese lifaka ifilimu elincanyana. Ngenxa yobulula bale ndlela, inezinga lokubeka eliphezulu kakhulu.

    • Amafilimu ajwayelekile afakiwe: ama-silicon oxides ane-doped futhi avuliwe, ama-silicon nitrides. Iphinde isetshenziswe kuukwehlisa.

    I-HDP CVD

    I-high density plasma chemical vapor deposition inguqulo ye-PECVD esebenzisa i-plasma ephakeme kakhulu, evumela ama-wafers ukuthi asabele ngezinga lokushisa eliphansi nakakhulu (phakathi kuka-80°C-150°C) ngaphakathi kwegumbi lokubeka. Lokhu futhi kudala ifilimu enamandla amakhulu okugcwalisa umsele.


    I-SACVD

    I-Suatmospheric chemical pressure deposition of vapor deposition ihlukile kwezinye izindlela ngoba iyenzeka ngaphansi komfutho wegumbi ojwayelekile futhi isebenzisa i-ozone (O3) ukusiza ukuvuselela ukusabela. Inqubo yokubeka yenzeka ngengcindezi ephakeme kune-LPCVD kodwa ephansi kune-APCVD, phakathi kuka-13,300 Pa kanye no-80,000 Pa. Amafilimu e-SACVD anezinga eliphezulu lokubeka futhi elithuthukayo njengoba izinga lokushisa likhuphuka lize lifike cishe ku-490°C, lapho liqala khona ukuncipha. .


  • Okwedlule:
  • Olandelayo:

  • I-Shandong Zhongpeng Special Ceramics Co., Ltd ingesinye sezixazululo ezintsha ze-silicon carbide zobumba eChina. I-ceramic yobuchwepheshe ye-SiC: Ubulukhuni be-Moh buyi-9 (ukuqina kwe-Moh entsha yi-13), enokumelana okuhle nokuguguleka nokugqwala, ukuhuzuka okuhle kakhulu – ukumelana ne-oxidation. Impilo yesevisi yomkhiqizo we-SiC iyinde izikhathi ezi-4 kuya kwezi-5 kune-alumina material engu-92%. I-MOR ye-RBSiC izikhathi ezi-5 kuye kweziyi-7 kune-SNBSC, ingasetshenziselwa izimo eziyinkimbinkimbi. Inqubo yekhotheshini iyashesha, ukulethwa kunjengoba kuthenjisiwe futhi ikhwalithi ingeyesibili. Sihlala siphikelela ekuphonseni inselelo imigomo yethu futhi sibuyisele izinhliziyo zethu emphakathini.

     

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